Saudi Arabia Cicor Tender

Cicor Group a leading manufacturer of printed circuit boards and hybrid circuits has selected SABICs LNP THERMOCOMP compounds with laser direct structuring LDS capability to produce high-end three-dimensional molded interconnect devices 3D-MIDs. Building on a longstanding relationship Cicor and SABIC successfully collaborated to meet multiple stringent requirements for sophisticated devices used in 5G networking automotive and consumer electronics applications. SABICs portfolio of LNP THERMOCOMP compounds delivers excellent flow for thin walls used in miniaturized designs optimized LDS performance to achieve uniform fine-pitch circuit patterns and high heat resistance for use in the surface mount technology SMT assembly process.SABIC is a pioneer in materials that enable laser direct structuring which is critical for producing highly integrated electronics that save precious space in smaller and thinner electronic devices said Joshua Chiaw Director Business Management LNP NORYL Specialties SABIC. As 3D-MID technology rapidly advanced and Cicor looked to innovate the design of its products to gain higher performance and precision SABIC was able to meet the companys needs. Were committed to leveraging our materials innovation and expertise to help customers like Cicor stay at the forefront of electronics megatrends.As we explored the use of liquid crystal polymers for our fine-pitch 3D-MID products we quickly found that SABICs LNP THERMOCOMP compounds which are based on LCPs far surpassed competitive offerings in the uniformity and precision of circuit traces and were clearly the solution that could best fit our needs said HS Song Managing Director China Suzhou Cicor Technology Co. Ltd. These materials also help us optimize yield rates to drive down total system costs. To further support our successful use of LNP THERMOCOMP compounds SABIC provided many value-added services including formulation adjustments. SABIC exemplifies supplier excellence through deep materials expertise unmatched technical capabilities and rapid response.INNOVATIVE MATERIAL TECHNOLOGY FOR MIDSMolded interconnect devices integrate electronic and mechanical functions in a single three-dimensional package to save space and weight compared to traditional printed circuit boards PCBs. These high-precision miniaturized devices help address rigorous demands for higher performance in smaller form factors that are arising from the implementation of 5G infrastructure and 5G-enabled applications. For instance 5G networking in cities requires many small cell towers placed close together to deliver faster data transmissionwhile remaining unobtrusive. SABICs LDS-enabled LNP THERMOCOMP materials can play an important role in designing and manufacturing high-end MIDs. The performance enables manufacturers to create fine-pitch devices which are distinguished by very narrow spacing 200 microns between leads and highly complex patterns. SABIC materials used to mold these devices incorporate laser-activated additives that allow conductive traces to be produced on the surface of the part and then metallized using electroless technology. These grades deliver precise and uniform metallization of these critical circuit traces. They also offer low stable dielectric constant Dk and dissipation Df properties.Exceptional flow properties 10 to 100 times better than that of other polymers combined with dimensional stability enable LNP THERMOCOMP compounds to be used for molding thin-wall parts that are less than 0.5 mm. The materials high flow also helps to accelerate throughput.Previously Cicor used high-performance semi-crystalline materials for its MIDs. However as MID specifications became increasingly demanding Cicor required the unique properties of SABICs LNP THERMOCOMP compounds. Compared to the incumbent polymers SABICs LNP THERMOCOMP compounds offer better dimensional stability which helps to reduce warpage and improve design precision. Another advantage is their elevated temperature resistance for undergoing SMT which is much higher than that of other polymers.