Telecommunications Energy, Power and Electrical

Light Emitting Cryo Tender

πŸ›οΈ AALTO KORKEAKOULUSAATIO SR
πŸ“„ Tender ID: 522813776 πŸ“… Published: 15 Sep 2025

πŸ“‹ Tender Overview

COOLED
Grant agreement ID: 101214431

DOI
10.3030/101214431

EC signature date
2 May 2025
Start date
1 June 2025
End date
31 May 2029
Objective

Semiconductor-based devices in fields like night vision, space exploration, medical inspection, and telecommunications benefit from operating at low or cryogenic temperatures. However, current cryogenic cooling technologies face challenges in meeting the size, costs, energy efficiency and performance requirements of modern applications. This has led to increasing demand for compact, high-performance electronics and efficient thermal management in miniaturized systems.

Optical refrigeration, powered by light-emitting diodes, presents a transformative cooling technology with immense application potential. We have developed an innovation that integrates high-refractive index lenses with low-resistance current-spreading solutions and thin-film light emitter technologies, significantly boosting light emission efficiency. This enhancement enables smaller and more cost-effective low-temperature and cryogenic optical cooling solutions.

The primary advantage of the COOLED technology is its ultra-compact size, using up to 95-99% less space than competing technologies. In COOLED, we will demonstrate the commercial feasibility of the solutions by testing these new coolers in industrially relevant use cases. We will also improve device fabrication scalability and performance, advancing from TRL4 to TRL6. Demonstrations will focus on room temperature thermal stabilizers, providing around 1W of cooling power, and optical refrigerators, enabling cryogenic cooling.

This novel cooling component will disrupt markets by offering a solution with lower prices, minimal size and weight, and enhanced production scalability compared to existing compact cooling options. Our commercialization plan involves establishing initial production facilities and global value chains for direct component sales by a new entity holding the IP generated during the EIC Transition project.

πŸ” Key Information

πŸ“„
Tender Reference No.
522813776
πŸ“…
Publication Date
15 Sep 2025
πŸ’°
Estimated Value
N/A
🌐
Sector
Telecommunications
πŸ“…
Deadline
31 May 2029
πŸ“
Notice Type
Projects
πŸ“
Location
Finland
πŸ“‘
Contract Duration
3 Years 8 Months 16 Days

πŸ“ Documents & Downloads

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🏷️ CPV

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πŸ•’ Submission deadline
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days remaining Β· 31 May 2029
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🧭 Quick Facts

Authority AALTO KORKEAKOULUSAATIO SR
Country Finland
State / UT N/A
Tender Type Project Information
Currency N/A
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