📋 Tender Overview
The Next Generation Of Sensors And Imagers Enabled By 2D Materials Digital Integration
Overcoming 2D Material Industrial Uptake Challengesgraphene And 2D Materials (2Dm) Present Promising Solutions For Sensors And Imagers, Offering Significantly Enhanced Optoelectronic Properties And Performance. Despite Their Potential, The Adoption And Industrial Integration Of These Materials Have Faced Obstacles In Achieving Wafer-Scale Integration Of High-Quality, Defect-Free 2Dm Layers During Si Foundry Process Lines. The Eu-Funded Next-2Digits Project Aims To Address This Challenge Through The Implementation Of Two Innovative Additive Technologies. These Technologies Are Expected To Revolutionise Manufacturing, Providing Defect-Free Interfaces, Improved Mobility, And Larger Bandwidths. Ultimately, The Project Seeks To Facilitate The Incorporation Of This Technology Into Photonic Integrated Circuits (Pics) And Micro-Electro-Mechanical Systems (Mems), Enhancing Ease Of Industrial Adoption And Reducing Costs.
Funded Under
Digital, Industry And Space
Total Cost
€ 5 134 570,50
Eu Contribution
€ 5 134 570,50
Coordinated By
Ethnicon Metsovion Polytechnion
Greece
Start Date
1 October 2023
End Date
31 December 2026
Objective
Graphene and 2D materials (2DM) have proven superior optoelectronic properties and performance in a plethora of applications with respect to conventional materials. Despite that, specific integration and processing challenges are impeding the industrial uptake of 2DM. In particular, the wafer-scale integration of high-quality and defect free 2DM layers, without disrupting the process-line Si foundries, has not been demonstrated. Next-2Digits will introduce the direct wafer-scale integration of 2DM in PICs using two additive technologies: i) semi dry transfer of Graphene layers for full wafer scale integration and direct die processing and ii) Laser Digital Transfer of pristine 2DM pixels directly on the stack without the need for post-processing. This will enable defect-free interfaces offering high carrier mobility and large bandwidth, paving the way for the next generation of on-chip Photodetectors (PDs) and Modulators which will be validated at TRL5 in three use cases:
1. A miniaturized LiDAR with integrated graphene PD offering high resolution (<0.1mm) and high speed in compact form factor validated in an UAV mapping system.
2. A PIC gas sensor with sensitivity down to 50ppm and miniaturized footprint offering multi-sensing capability validated in a biogas plant leakage sensing system.
3. An on-chip PD receiver offering extended bandwidth (>100nm), high resolution and responsivity >0.5A/W validated in a biomedical OCT imaging system.
The project will foster the incorporation of 2DM in PICs and MEMS foundries, enabling future industrial uptake and significantly shorter time-to-market for 2DM-based devices. Companies will be able to offer PIC-based components with (up to 6x times) lower power consumption, lower size (i
